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Large Rocket Fuel Cache Partition II

Make 1 Large Rocket Fuel Cache Partition II at Manufacturing facility using 30 Power Circuit, 30 Logic Circuit, 1 R.A.M.- Weapon Tech.

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Large Salvage Tackle I

Rig Resource Processing

Make 1 Large Salvage Tackle I at Manufacturing facility using 100 Fried Interface Circuit, 89 Armor Plates, 67 Contaminated Nanite Compound.

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Large Salvage Tackle II

Rig Resource Processing

Make 1 Large Salvage Tackle II at Manufacturing facility using 24 Intact Armor Plates, 18 Nanite Compound, 1 R.A.M.- Armor/Hull Tech.

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Large Scoped Vorton Projector

Vorton Projector

Make 1 Large Scoped Vorton Projector at Manufacturing facility using 1 Large Vorton Projector I, 12 Electromagnetic Metaprismatic Sheeting.

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Large Semiconductor Memory Cell I

Rig Core

Make 1 Large Semiconductor Memory Cell I at Manufacturing facility using 167 Burned Logic Circuit, 56 Melted Capacitor Console, 167 Tripped Power Circuit.

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Large Semiconductor Memory Cell II

Rig Core

Make 1 Large Semiconductor Memory Cell II at Manufacturing facility using 45 Power Circuit, 1 R.A.M.- Energy Tech, 45 Logic Circuit.

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Large Sentry Damage Augmentor I

Make 1 Large Sentry Damage Augmentor I at Manufacturing facility using 114 Burned Logic Circuit, 104 Broken Drone Transceiver, 117 Tripped Power Circuit.

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Large Sentry Damage Augmentor II

Make 1 Large Sentry Damage Augmentor II at Manufacturing facility using 1 R.A.M.- Robotics, 32 Logic Circuit, 32 Power Circuit.

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Large Shield Booster I

Shield Booster

Make 1 Large Shield Booster I at Manufacturing facility using 1327 Mexallon, 481 Isogen, 113 Nocxium.

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Large Shield Booster II

Shield Booster

Make 1 Large Shield Booster II at Manufacturing facility using 6 Morphite, 6 Superconductors, 1 Large Shield Booster I.

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Large Shield Extender I

Shield Extender

Make 1 Large Shield Extender I at Manufacturing facility using 3383 Tritanium, 2769 Pyerite, 181 Mexallon.

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Large Shield Extender II

Shield Extender

Make 1 Large Shield Extender II at Manufacturing facility using 12 Hydrogen Batteries, 12 Sustained Shield Emitter, 6 Morphite.

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Large Signal Disruption Amplifier I

Make 1 Large Signal Disruption Amplifier I at Manufacturing facility using 33 Conductive Polymer, 78 Damaged Artificial Neural Network, 89 Tripped Power Circuit.

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Large Signal Disruption Amplifier II

Make 1 Large Signal Disruption Amplifier II at Manufacturing facility using 21 Artificial Neural Network, 24 Power Circuit, 1 R.A.M.- Electronics.

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Large Signal Focusing Kit I

Rig Scanning

Make 1 Large Signal Focusing Kit I at Manufacturing facility using 67 Burned Logic Circuit, 89 Damaged Artificial Neural Network, 56 Charred Micro Circuit.

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Large Signal Focusing Kit II

Rig Scanning

Make 1 Large Signal Focusing Kit II at Manufacturing facility using 24 Artificial Neural Network, 18 Logic Circuit, 24 Miniature Electronics.

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Large Stasis Drone Augmentor I

Make 1 Large Stasis Drone Augmentor I at Manufacturing facility using 128 Burned Logic Circuit, 116 Broken Drone Transceiver, 134 Tripped Power Circuit.

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Large Stasis Drone Augmentor II

Make 1 Large Stasis Drone Augmentor II at Manufacturing facility using 1 R.A.M.- Robotics, 35 Logic Circuit, 36 Power Circuit.

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Large Targeting System Subcontroller I

Rig Targeting

Make 1 Large Targeting System Subcontroller I at Manufacturing facility using 111 Burned Logic Circuit, 89 Damaged Artificial Neural Network, 111 Charred Micro Circuit.

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Large Targeting System Subcontroller II

Rig Targeting

Make 1 Large Targeting System Subcontroller II at Manufacturing facility using 24 Artificial Neural Network, 30 Logic Circuit, 24 Miniature Electronics.

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Large Targeting Systems Stabilizer I

Make 1 Large Targeting Systems Stabilizer I at Manufacturing facility using 111 Burned Logic Circuit, 89 Damaged Artificial Neural Network, 111 Charred Micro Circuit.

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Large Targeting Systems Stabilizer II

Make 1 Large Targeting Systems Stabilizer II at Manufacturing facility using 24 Artificial Neural Network, 30 Logic Circuit, 24 Miniature Electronics.

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Large Thermal Armor Reinforcer I

Make 1 Large Thermal Armor Reinforcer I at Manufacturing facility using 83 Fried Interface Circuit, 72 Armor Plates, 44 Contaminated Nanite Compound.

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Large Thermal Armor Reinforcer II

Make 1 Large Thermal Armor Reinforcer II at Manufacturing facility using 20 Intact Armor Plates, 12 Nanite Compound, 1 R.A.M.- Armor/Hull Tech.

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Large Thermal Shield Reinforcer I

Rig Shield

Make 1 Large Thermal Shield Reinforcer I at Manufacturing facility using 83 Fried Interface Circuit, 44 Malfunctioning Shield Emitter, 72 Charred Micro Circuit.

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Large Thermal Shield Reinforcer II

Rig Shield

Make 1 Large Thermal Shield Reinforcer II at Manufacturing facility using 12 Intact Shield Emitter, 23 Interface Circuit, 20 Micro Circuit.

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Large Tracking Diagnostic Subroutines I

Make 1 Large Tracking Diagnostic Subroutines I at Manufacturing facility using 100 Fried Interface Circuit, 67 Damaged Artificial Neural Network, 89 Charred Micro Circuit.

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Large Tracking Diagnostic Subroutines II

Make 1 Large Tracking Diagnostic Subroutines II at Manufacturing facility using 18 Artificial Neural Network, 27 Logic Circuit, 24 Miniature Electronics.

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Large Transverse Bulkhead I

Make 1 Large Transverse Bulkhead I at Manufacturing facility using 83 Fried Interface Circuit, 111 Alloyed Tritanium Bar, 111 Contaminated Nanite Compound.

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Large Transverse Bulkhead II

Make 1 Large Transverse Bulkhead II at Manufacturing facility using 1 R.A.M.- Armor/Hull Tech, 15 Interface Circuit, 20 Single-crystal Superalloy I-beam.

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Large Trimark Armor Pump I

Make 1 Large Trimark Armor Pump I at Manufacturing facility using 83 Fried Interface Circuit, 72 Armor Plates, 56 Contaminated Nanite Compound.

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Large Trimark Armor Pump II

Make 1 Large Trimark Armor Pump II at Manufacturing facility using 20 Intact Armor Plates, 15 Nanite Compound, 1 R.A.M.- Armor/Hull Tech.

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Large Vorton Projector I

Vorton Projector

Make 1 Large Vorton Projector I at Manufacturing facility using 12 Electromagnetic Metaprismatic Sheeting, 24 Hyperbolic Metatransistor Array, 82 Ultraconducting Ablative Nanocable.

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Large Vorton Projector II

Vorton Projector

Make 1 Large Vorton Projector II at Manufacturing facility using 1 R.A.M.- Weapon Tech, 1 Large Vorton Projector I, 14 Robotics.

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Large Warhead Calefaction Catalyst I

Make 1 Large Warhead Calefaction Catalyst I at Manufacturing facility using 138 Burned Logic Circuit, 116 Scorched Telemetry Processor, 89 Tripped Power Circuit.

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Large Warhead Calefaction Catalyst II

Make 1 Large Warhead Calefaction Catalyst II at Manufacturing facility using 24 Power Circuit, 38 Logic Circuit, 1 R.A.M.- Weapon Tech.

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Large Warhead Flare Catalyst I

Make 1 Large Warhead Flare Catalyst I at Manufacturing facility using 100 Burned Logic Circuit, 67 Scorched Telemetry Processor, 89 Tripped Power Circuit.

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Large Warhead Flare Catalyst II

Make 1 Large Warhead Flare Catalyst II at Manufacturing facility using 24 Power Circuit, 27 Logic Circuit, 1 R.A.M.- Weapon Tech.

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Large Warhead Rigor Catalyst I