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Structures and deployables

Standup L-Set Moon Drilling Proficiency I

Structure Drilling Rig L - Proficiency

Make 1 Standup L-Set Moon Drilling Proficiency I at Manufacturing facility using 12000 Malfunctioning Shield Emitter, 12000 Contaminated Lorentz Fluid, 12000 Tangled Power Conduit.

1 recipe

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Structures and deployables

Standup L-Set Moon Drilling Proficiency II

Structure Drilling Rig L - Proficiency

Make 1 Standup L-Set Moon Drilling Proficiency II at Manufacturing facility using 1 R.A.M.- Robotics, 160 Intact Shield Emitter, 160 Enhanced Ward Console.

1 recipe

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Structures and deployables

Standup L-Set Point Defense Battery Control I

Structure Combat Rig L - Point Defense Battery Application and Projection

Make 1 Standup L-Set Point Defense Battery Control I at Manufacturing facility using 1625 Alloyed Tritanium Bar, 5000 Ward Console, 7500 Scorched Telemetry Processor.

1 recipe

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Structures and deployables

Standup L-Set Point Defense Battery Control II

Structure Combat Rig L - Point Defense Battery Application and Projection

Make 1 Standup L-Set Point Defense Battery Control II at Manufacturing facility using 1 R.A.M.- Robotics, 60 Intact Shield Emitter, 60 Single-crystal Superalloy I-beam.

1 recipe

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Structures and deployables

Standup L-Set Reactor Efficiency I

Structure Reactor Rig L - Efficiency

Make 1 Standup L-Set Reactor Efficiency I at Manufacturing facility using 10500 Tangled Power Conduit, 12000 Scorched Telemetry Processor, 12000 Contaminated Nanite Compound.

1 recipe

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Structures and deployables

Standup L-Set Reactor Efficiency II

Structure Reactor Rig L - Efficiency

Make 1 Standup L-Set Reactor Efficiency II at Manufacturing facility using 1 R.A.M.- Robotics, 160 Nanite Compound, 160 Single-crystal Superalloy I-beam.

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Structures and deployables

Standup L-Set Reprocessing Monitor I

Structure Resource Rig L - Reprocessing

Make 1 Standup L-Set Reprocessing Monitor I at Manufacturing facility using 500 Alloyed Tritanium Bar, 500 Armor Plates, 11250 Contaminated Nanite Compound.

1 recipe

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Structures and deployables

Standup L-Set Reprocessing Monitor II

Structure Resource Rig L - Reprocessing

Make 1 Standup L-Set Reprocessing Monitor II at Manufacturing facility using 1 R.A.M.- Ammunition Tech, 30 Intact Armor Plates, 240 Nanite Compound.

1 recipe

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Structures and deployables

Standup L-Set Structure Manufacturing Efficiency I

Structure Engineering Rig L - Structure Efficiency

Make 1 Standup L-Set Structure Manufacturing Efficiency I at Manufacturing facility using 3600 Tripped Power Circuit, 7200 Contaminated Nanite Compound, 10800 Fried Interface Circuit.

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Structures and deployables

Standup L-Set Structure Manufacturing Efficiency II

Structure Engineering Rig L - Structure Efficiency

Make 1 Standup L-Set Structure Manufacturing Efficiency II at Manufacturing facility using 1 R.A.M.- Armor/Hull Tech, 160 Power Circuit, 200 Nanite Compound.

1 recipe

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Structures and deployables

Standup L-Set Target Acquisition Array I

Structure Combat Rig L - Max Targets and Sensor Boosting

Make 1 Standup L-Set Target Acquisition Array I at Manufacturing facility using 1625 Alloyed Tritanium Bar, 5000 Ward Console, 7500 Scorched Telemetry Processor.

1 recipe

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Structures and deployables

Standup L-Set Target Acquisition Array II

Structure Combat Rig L - Max Targets and Sensor Boosting

Make 1 Standup L-Set Target Acquisition Array II at Manufacturing facility using 1 R.A.M.- Electronics, 60 Intact Shield Emitter, 60 Single-crystal Superalloy I-beam.

1 recipe

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Structures and deployables

Standup L-Set TE Research Optimization I

Structure Engineering Rig L - TE Research Optimization

Make 1 Standup L-Set TE Research Optimization I at Manufacturing facility using 2400 Burned Logic Circuit, 12000 Fried Interface Circuit, 12000 Melted Capacitor Console.

1 recipe

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Structures and deployables

Standup L-Set TE Research Optimization II

Structure Engineering Rig L - TE Research Optimization

Make 1 Standup L-Set TE Research Optimization II at Manufacturing facility using 1 R.A.M.- Electronics, 160 Logic Circuit, 160 Interface Circuit.

1 recipe

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Structures and deployables

Standup L-Set Thukker Advanced Component Manufacturing Efficiency

Structure Engineering Rig L - Advanced Component Efficiency

Make 1 Standup L-Set Thukker Advanced Component Manufacturing Efficiency at Manufacturing facility using 1 Standup L-Set Advanced Component Manufacturing Efficiency I, 200 Covert Research Tools.

1 recipe

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Structures and deployables

Standup L-Set Thukker Basic Capital Component Manufacturing Efficiency

Structure Engineering Rig L - Basic Capital Component Efficiency

Make 1 Standup L-Set Thukker Basic Capital Component Manufacturing Efficiency at Manufacturing facility using 1 Standup L-Set Basic Capital Component Manufacturing Efficiency I, 200 Covert Research Tools.

1 recipe

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Charges and ammunition

Standup Ladar ECM Script

Structure ECM script

Make 1 Standup Ladar ECM Script at Manufacturing facility using 3 Megacyte, 7 Zydrine, 15 Nocxium.

1 recipe

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Structures and deployables

Standup Layered Armor Plating I

Structure Armor Reinforcer

Make 1 Standup Layered Armor Plating I at Manufacturing facility using 100 Megacyte, 350 Zydrine, 600 Nocxium.

1 recipe

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Structures and deployables

Standup Layered Armor Plating II

Structure Armor Reinforcer

Make 1 Standup Layered Armor Plating II at Manufacturing facility using 1 Standup Layered Armor Plating I, 5 R.A.M.- Armor/Hull Tech, 1200 Fernite Carbide Composite Armor Plate.

1 recipe

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Charges and ammunition

Standup Light Guided Bomb

Guided Bomb

Make 1 Standup Light Guided Bomb at Manufacturing facility using 45 Megacyte, 105 Zydrine, 225 Nocxium.

1 recipe

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Charges and ammunition

Standup Light Missile

Structure Anti-Subcapital Missile

Make 100 Standup Light Missile at Manufacturing facility using 23 Megacyte, 53 Zydrine, 113 Nocxium.

1 recipe

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Structures and deployables

Standup M-Set Advanced Component Manufacturing Material Efficiency I

Structure Engineering Rig M - Advanced Component ME

Make 1 Standup M-Set Advanced Component Manufacturing Material Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Advanced Component Manufacturing Material Efficiency II

Structure Engineering Rig M - Advanced Component ME

Make 1 Standup M-Set Advanced Component Manufacturing Material Efficiency II at Manufacturing facility using 1 R.A.M.- Armor/Hull Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Advanced Component Manufacturing Time Efficiency I

Structure Engineering Rig M - Advanced Component TE

Make 1 Standup M-Set Advanced Component Manufacturing Time Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Advanced Component Manufacturing Time Efficiency II

Structure Engineering Rig M - Advanced Component TE

Make 1 Standup M-Set Advanced Component Manufacturing Time Efficiency II at Manufacturing facility using 1 R.A.M.- Armor/Hull Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Advanced Large Ship Manufacturing Material Efficiency I

Structure Engineering Rig M - Advanced Large Ship ME

Make 1 Standup M-Set Advanced Large Ship Manufacturing Material Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Advanced Large Ship Manufacturing Material Efficiency II

Structure Engineering Rig M - Advanced Large Ship ME

Make 1 Standup M-Set Advanced Large Ship Manufacturing Material Efficiency II at Manufacturing facility using 1 R.A.M.- Starship Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Advanced Large Ship Manufacturing Time Efficiency I

Structure Engineering Rig M - Advanced Large Ship TE

Make 1 Standup M-Set Advanced Large Ship Manufacturing Time Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Advanced Large Ship Manufacturing Time Efficiency II

Structure Engineering Rig M - Advanced Large Ship TE

Make 1 Standup M-Set Advanced Large Ship Manufacturing Time Efficiency II at Manufacturing facility using 1 R.A.M.- Starship Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Advanced Medium Ship Manufacturing Material Efficiency I

Structure Engineering Rig M - Advanced Medium Ship ME

Make 1 Standup M-Set Advanced Medium Ship Manufacturing Material Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Advanced Medium Ship Manufacturing Material Efficiency II

Structure Engineering Rig M - Advanced Medium Ship ME

Make 1 Standup M-Set Advanced Medium Ship Manufacturing Material Efficiency II at Manufacturing facility using 1 R.A.M.- Starship Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Advanced Medium Ship Manufacturing Time Efficiency I

Structure Engineering Rig M - Advanced Medium Ship TE

Make 1 Standup M-Set Advanced Medium Ship Manufacturing Time Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Advanced Medium Ship Manufacturing Time Efficiency II

Structure Engineering Rig M - Advanced Medium Ship TE

Make 1 Standup M-Set Advanced Medium Ship Manufacturing Time Efficiency II at Manufacturing facility using 1 R.A.M.- Starship Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Advanced Small Ship Manufacturing Material Efficiency I

Structure Engineering Rig M - Advanced Small Ship ME

Make 1 Standup M-Set Advanced Small Ship Manufacturing Material Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Advanced Small Ship Manufacturing Material Efficiency II

Structure Engineering Rig M - Advanced Small Ship ME

Make 1 Standup M-Set Advanced Small Ship Manufacturing Material Efficiency II at Manufacturing facility using 1 R.A.M.- Starship Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Advanced Small Ship Manufacturing Time Efficiency I

Structure Engineering Rig M - Advanced Small Ship TE

Make 1 Standup M-Set Advanced Small Ship Manufacturing Time Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Advanced Small Ship Manufacturing Time Efficiency II

Structure Engineering Rig M - Advanced Small Ship TE

Make 1 Standup M-Set Advanced Small Ship Manufacturing Time Efficiency II at Manufacturing facility using 1 R.A.M.- Starship Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Ammunition Manufacturing Material Efficiency I

Structure Engineering Rig M - Ammunition ME

Make 1 Standup M-Set Ammunition Manufacturing Material Efficiency I at Manufacturing facility using 480 Tripped Power Circuit, 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit.

1 recipe

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Structures and deployables

Standup M-Set Ammunition Manufacturing Material Efficiency II

Structure Engineering Rig M - Ammunition ME

Make 1 Standup M-Set Ammunition Manufacturing Material Efficiency II at Manufacturing facility using 1 R.A.M.- Robotics, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Ammunition Manufacturing Time Efficiency I

Structure Engineering Rig M - Ammunition TE

Make 1 Standup M-Set Ammunition Manufacturing Time Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Ammunition Manufacturing Time Efficiency II

Structure Engineering Rig M - Ammunition TE

Make 1 Standup M-Set Ammunition Manufacturing Time Efficiency II at Manufacturing facility using 1 R.A.M.- Robotics, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Asteroid Ore Grading Processor I

Structure Resource Rig M - Asteroid Ore Reprocessing

Make 1 Standup M-Set Asteroid Ore Grading Processor I at Manufacturing facility using 40 Alloyed Tritanium Bar, 40 Armor Plates, 900 Contaminated Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Asteroid Ore Grading Processor II

Structure Resource Rig M - Asteroid Ore Reprocessing

Make 1 Standup M-Set Asteroid Ore Grading Processor II at Manufacturing facility using 1 R.A.M.- Ammunition Tech, 2 Intact Armor Plates, 16 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Basic Capital Component Manufacturing Material Efficiency I

Structure Engineering Rig M - Basic Capital Component ME

Make 1 Standup M-Set Basic Capital Component Manufacturing Material Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Basic Capital Component Manufacturing Material Efficiency II

Structure Engineering Rig M - Basic Capital Component ME

Make 1 Standup M-Set Basic Capital Component Manufacturing Material Efficiency II at Manufacturing facility using 1 R.A.M.- Armor/Hull Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Basic Capital Component Manufacturing Time Efficiency I

Structure Engineering Rig M - Basic Capital Component TE

Make 1 Standup M-Set Basic Capital Component Manufacturing Time Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe

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Structures and deployables

Standup M-Set Basic Capital Component Manufacturing Time Efficiency II

Structure Engineering Rig M - Basic Capital Component TE

Make 1 Standup M-Set Basic Capital Component Manufacturing Time Efficiency II at Manufacturing facility using 1 R.A.M.- Armor/Hull Tech, 16 Power Circuit, 20 Nanite Compound.

1 recipe

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Structures and deployables

Standup M-Set Basic Large Ship Manufacturing Material Efficiency I

Structure Engineering Rig M - Basic Large Ship ME

Make 1 Standup M-Set Basic Large Ship Manufacturing Material Efficiency I at Manufacturing facility using 960 Contaminated Nanite Compound, 1440 Fried Interface Circuit, 1600 Contaminated Lorentz Fluid.

1 recipe